PCB-Level EMC, part I

Components & Transmission Lines

The fundamental mechanisms of EMC-Problems at PCB-level are explained.
Instead of establishing primitive rules, which may cause trouble themselves if not properly understood, the attendee will learn to understand the underlying phenomena.
The key EMC-components are analyzed in depth, with a focus on their real-live properties. Understanding the capabilities and shortcomings of capacitors puts their successful utilization on a sound basis. The deeper understanding of the principal causes of EMI forms the basis for the chapters to come. The true nature of signal-propagation is explored and targets for the successful design of signallines are defined. The adverse impact of common design errors in GND topologies on X-Talk and radiated emission is discussed. Guidelines for the correct design are given and explained.

All topics are thoroughly and vividly explained, proven solutions are presented. This way, the attendee develops an instinctive „feel“ for possible pitfalls, thus successfully implementing the solutions.


The attendee is able to detect and understand potential causes of EMI. He is aware of the difference between theoretical and real-live properties of components. He is able to design controlled-impedance transmissionlines and is familiar with the dos and don'ts. The attendee understands the crucial importance of properly designed GND-topologies and knows how to implement them.

Who should attend?

Engineers and technicians confronted with EMC-issues in electronic hardware design. Printed wiring layout professionals with a fair understanding of the basics of electromagnetic theory.